||Post Cu/Low-k CMP Cleaning Solution, "MCX-SDR4"
|Generic Product Name
||Advanced Cleaning Solutions
||Mitsubishi Chemical Corporation
||Semiconductor Materials Dept., Information & Electronics Div., Advanced Solutions
||During the post CMP cleaning process in semiconductor manufacturing, it is important to remove organic residues and particles on Cu wires and Low-k films without damaging the substrate. Our product, MCX-SDR4, is a high-efficiency cleaning solution suited for semiconductor industries. Characteristics: -High efficiency particle removal -Removes organic residues effectively -Limits galvanic corrosion on Cu wire -Limits Low-k damage -Improves Low-k wetting properties